Laser Cutting of materials ranging from 0.7 mm to 16 mm thickness, Computer nesting in conjunction with Laser programming ensures optimum production efficiency.

Five Bystronic Laser Cutting centres. One with 4.0 x 2.0 metre, Two with 3 x 1.5 metre and two with 2.5 x 1.25 metre inter-changeable tables and magnetic loading facilities.